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1 : in the manufacture of plastic semiconductor packages, the plastic excesses that remain after normal molding, deflashing, trimming, and singulation processing. [SEMI G14-88] Also called parting line protrusions or intrusions. 2 : a surface defect on molded packages that consists of parent material. Also called top or bottom protrusions. Also see bubble, blister ceramic, blister metal, and projection. 3 : the dambar section of a leadframe (tab) that remains after dambar trimming when the trimming punch is not totally in line with the lead shoulder by design or misalignment. Also called lead shoulder protrusions or intrusions and shoulder width intrusions.
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