|
in cofired ceramic packages, pin movement, measured with respect to a datum perpendicular to the top or bottom of the package, that passes through the designed midpoint of the pin where the pin is attached to the package (for example, pin grid arrays). The movement is viewed from the ends of the package, not the side, and the pin movement is from the edges of the package in toward the center line of the package. [SEMI G61-94]
|