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1 : on ceramic package bases, screen printed metals, such as refractory metals; for example, tungsten. Also see refractory metallization . 2 : electrolytic or electroless plated metals; for example, nickel and gold, on base metals such as leadframes, or on top of refractory metallizations. 3 : on cerdip or cerpack leadframes, evaporated or clad metals; for example, aluminum. 4 : the deposition of a thin film of conductive metal onto a wafer or substrate by use of either chemical or physical vapor deposition (for example, sputtering).
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