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1 : on a stamped leadframe, the area on the internal lead tips that is suitable for wire bonding. Suitability for wire bonding is typically achieved by coining the surface. [SEMI G9-89] 2 : of a nominal leadframe bond finger, the area that is suitable for wire bonding. This area may be specified as a percentage of the nominal finger width (usually 80%) for a specified length for both stamped and etched leadframes, or by the width and length of a coined area in stamped leadframes. In ceramic packages, the effective area of a bond finger is specified as a void-free area within the confines of the nominal finger area. Also called effective wire bond area and minimum flat wire bonding area.
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