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1 : in a cofired ceramic semiconductor package, the area that is designated for die attach. The nominal area is defined by the limits of the bond finger ledge (or wire bond cavity). Also see effective die attach area . 2 : the overall area for wire bonds in a cofired ceramic package. 3 : in a mold for plastic packages, the areas of the mold that become filled with plastic during the molding cycle, encapsulate the die, and form the body of the device. A mold has matching upper and lower cavities, and the term cavity is also used to describe the top or bottom of a finished plastic package. 4 : a vacancy or empty space in a wafer. A cavity usually is left by dissolved precipitates or gallium inclusions or by arsenic dissociation, or it may be created by excessive vapor pressure. [SEMI M10-89] 5 : in pellicle technology, an unfilled space between the photomask and the optically transparent film within the mounted pellicle frame area. [SEMI P5-86]
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